Części elektroniczne : MR18R326GAG0-CT9

Producent : SAMSUNG[Samsung semiconductor]

Pakowanie :

Pins :

Opis : (32Mx18) 16pcs RIMM Module based 576Mb A-die banks32K/32ms 2.5V

Temperatura : Min °C | Max °C

Datasheet : MR18R326GAG0-CT9 PDF

• MR18R326GAG0
• MR18R326GAG0-CM8
• MR18R326GAG0-CT9